# UIET KUK MTech Syllabus

Engineering Entrance Exam » UIET KUK »**UIET KUK MTech 2021 Syllabus**

**1 ) Electronics and Communication Engineering**

**Networks, Signals and Systems**

**Network solution methods :** nodal and mesh analysis; Network theorems: superposition, Thevenin and Norton’s, maximum power transfer; Wye‐Delta transformation; Steady state sinusoidal analysis using phasors; Time domain analysis of simple linear circuits; Solution of network equations using Laplace transform; Frequency domain analysis of RLC circuits; Linear 2‐port network parameters: driving point and transfer functions; State equations for networks.

**Continuous-time signals :** Fourier series and Fourier transform representations, sampling theorem and applications; Discrete-time signals: discrete-time Fourier transform ( DTFT ), DFT, FFT, Ztransform, interpolation of discrete -time signals; LTI systems: definition and properties, causality, stability, impulse response, convolution, poles and zeros, parallel and cascade structure, frequency response, group delay, phase delay, digital filter design techniques.

**Electronic Devices : **Energy bands in silicon, intrinsic and extrinsic silicon. Carrier transport in silicon : diffusion current, drift current, mobility, and resistivity. Generation and recombination of carriers.p – n junction diode, Zener diode, tunnel diode, BJT, JFET, MOS capacitor, MOSFET, LED, p – I – n and avalanche photo diode, Basics of LASERs. Device technology : integrated circuits fabrication process, oxidation, diffusion, ion implantation, photolithography, n – tub, p – tub and twin – tub CMOS process.

**Analog Circuits : **Small Signal Equivalent circuits of diodes, BJTs, MOSFETs and analog CMOS. Simple diode circuits, clipping, clamping, rectifier. Biasing and bias stability of transistor and FET amplifiers. Amplifiers : singleand multi – stage, differential and operational, feedback, and power. Frequency response of amplifiers.Simple op – amp circuits. Filters.Sinusoidal oscillators; criterion for oscillation; single – transistor and op – amp configurations. Function generators and wave – shaping circuits, 555 Timers. Power supplies. ripple removal and regulation

**Digital circuits : **Boolean algebra, minimization of Boolean functions; logic gates; digital IC families ( DTL, TTL, ECL, MOS, CMOS ). Combinatorial circuits : arithmetic circuits, code converters, multiplexers, decoders, PROMs and PLAs. Sequential circuits : latches and flip – flops, counters and shift – registers. Sample and hold circuits, ADCs, DACs. Semiconductor memories.Microprocessor ( 8085 ) : architecture, programming, memory and I / O interfacing.

**Control Systems : **Basic control system components; Feedback principle; Transfer function; Block diagram

representation; Signal flow graph; Transient and steady-state analysis of LTI systems; Frequency response; Routh-Hurwitz and Nyquist stability criteria; Bode and root-locus plots; Lag, lead and lag-lead compensation; State variable model and solution of state equation of LTI systems.

**Communications : **Random signals and noise : probability, random variables, probability density function, autocorrelation, power spectral density. Analog communication systems : amplitude and angle modulation and demodulation systems, spectral analysis of these operations, superheterodyne receivers; elements of hardware, realizations of analog communication systems; signal – to – noise ratio ( SNR ) calculations for amplitudemodulation ( AM ) and frequency modulation ( FM ) for low noise conditions. Fundamentals of information theory and channel capacity theorem. Digital communication systems : pulse code modulation ( PCM ), differential pulse code modulation ( DPCM ), digital modulation schemes : amplitude, phase and frequency shift keying schemes ( ASK, PSK, FSK ), matched filter receivers, bandwidth consideration and probability of error calculations for these schemes. Basics of TDMA, FDMA and CDMA

**Electromagnetics : **Electrostatics; Maxwell’s equations: differential and integral forms and their interpretation, boundary conditions, wave equation, Poynting vector; Plane waves and properties: reflection and refraction, polarization, phase and group velocity, propagation through various media, skin depth; Transmission lines: equations, characteristic impedance, impedance matching, impedance transformation, S-parameters, Smith chart; Waveguides: modes, boundary conditions, cut-off frequencies, dispersion relations; Antennas: antenna types, radiation pattern, gain and directivity, return loss, antenna arrays; Basics of radar; Light propagation in optical fibers

**2 ) Computer Engineerig / Software Engineering**

**Digital Logic : **Logic functions, Minimization, Design and synthesis of combinational and sequential circuits; Number representation and computer arithmetic ( fixed and floating point ).

**Computer Organization and Architecture : **Machine instructions and addressing modes, ALU and data – path, CPU control design, Memory interface, I / O interface ( Interrupt and DMA mode )

**Programming and Data Structures : **Programming in C. Recursion. Arrays, stacks, queues, linked lists, trees, binary search trees, binary heaps, graphs.

**Algorithms : **Searching, sorting, hashing. Asymptotic worst case time and space complexity. Algorithm

design techniques: greedy, dynamic programming and divide‐and‐conquer. Graph search, minimum spanning trees, shortest paths.

**Theory of Computation : **Regular expressions and finite automata. Context-free grammars and push-down automata. Regular and contex-free languages, pumping lemma. Turing machines and undecidability.

**Compiler Design :**Lexical analysis, parsing, syntax-directed translation. Runtime environments. Intermediate code generation.

**Operating System : **Processes, threads, inter‐process communication, concurrency and synchronization. Deadlock. CPU scheduling. Memory management and virtual memory. File systems.

**Databases : **ER‐model. Relational model: relational algebra, tuple calculus, SQL. Integrity constraints, normal forms. File organization, indexing ( e.g., B and B+ trees ). Transactions and concurrency control.

**Computer Networks : **Concept of layering. LAN technologies ( Ethernet ). Flow and error control techniques, switching. IPv4/IPv6, routers and routing algorithms ( distance vector, link state ). TCP / UDP and sockets, congestion control. Application layer protocols ( DNS, SMTP, POP, FTP, HTTP ). Basics of WiFi. Network security: authentication, basics of public key and private key cryptography, digital signatures and certificates, firewalls.

**3 ) Biotechnology**

**Biochemistry :** Biomolecules-structure and functions; Biological membranes, structure, action potential and transport processes; Enzymes- classification, kinetics and mechanism of action; Basic concepts and designs of metabolism ( carbohydrates, lipids, amino acids and nucleic acids ) photosynthesis, respiration and electron transport chain; Bioenergetics

**Microbiology : **Viruses- structure and classification; Microbial classification and diversity ( bacterial, algal and fungal ); Methods in microbiology; Microbial growth and nutrition; Aerobic and anaerobic respiration; Nitrogen fixation; Microbial diseases and host-pathogen interaction

**Cell Biology :** Prokaryotic and eukaryotic cell structure; Cell cycle and cell growth control; CellCell communication, Cell signaling and signal transduction

**Molecular Biology and Genetics : **Molecular structure of genes and chromosomes; Mutations and mutagenesis; Nucleic acid replication, transcription, translation and their regulatory mechanisms in prokaryotes and eukaryotes; Mendelian inheritance; Gene interaction; Complementation; Linkage, recombination and chromosome mapping; Extra chromosomal inheritance; Microbial genetics ( plasmids, transformation, transduction, conjugation ); Horizontal gene transfer and Transposable elements; RNA interference; DNA damage and repair; Chromosomal variation; Molecular basis of genetic diseases

**Analytical Techniques :** Principles of microscopy-light, electron, fluorescent and confocal; Centrifugation- high speed and ultra; Principles of spectroscopy-UV, visible, CD, IR, FTIR, Raman, MS,NMR; Principles of chromatography- ion exchange, gel filtration, hydrophobic interaction, affinity, GC,HPLC, FPLC; Electrophoresis; Microarray

**Immunology : **History of Immunology; Innate, humoral and cell mediated immunity; Antigen; Antibody structure and function; Molecular basis of antibody diversity; Synthesis of antibody and secretion; Antigen-antibody reaction; Complement; Primary and secondary lymphoid organ; B and T cells and macrophages; Major histocompatibility complex ( MHC ); Antigen processing and presentation; Polyclonal and monoclonal antibody; Regulation of immune response; Immune tolerance; Hypersensitivity; Autoimmunity; Graft versus host reaction.

**Bioinformatics : **Bioinformatics: Major bioinformatic resources and search tools; Sequence and structure

databases; Sequence analysis ( biomolecular sequence file formats, scoring matrices, sequence alignment, phylogeny ); Data mining and analytical tools for genomic and proteomic studies; Molecular dynamics and simulations ( basic concepts including force fields, protein-protein, protein-nucleic acid, protein-ligand interaction )

**Recombinant DNA Technology :** Restriction and modification enzymes; Vectors; plasmid, bacteriophage and other viral vectors, cosmids, Ti plasmid, yeast artificial chromosome; mammalian and plant expression vectors; cDNA and genomic DNA library; Gene isolation, cloning and expression ; Transposons and gene targeting; DNA labeling; DNA sequencing; Polymerase chain reactions; DNA fingerprinting; Southern and northern blotting; In-situ hybridization; RAPD, RFLP; Site-directed mutagenesis; Gene transfer technologies; Gene therapy

**Plant and Animal Biotechnology : **Totipotency; Regeneration of plants; Plant growth regulators and elicitors; Tissue culture and Cell suspension culture system: methodology, kinetics of growth and, nutrient optimization; Production of secondary metabolites by plant suspension cultures; Hairy root culture; transgenic plants; Plant products of industrial importance

Animal cell culture; media composition and growth conditions; Animal cell and tissue preservation; Anchorage and non-anchorage dependent cell culture; Kinetics of cell growth; Micro & macro-carrier culture; Hybridoma technology; Stem cell technology; Animal cloning; Transgenic animals

**Bioprocess Engineering and Process Biotechnology : **Chemical engineering principles applied to biological system, Principle of reactor design, ideal and non-ideal multiphase bioreactors, mass and heat transfer; Rheology of fermentation fluids, Aeration and agitation; Media formulation and optimization; Kinetics of microbial growth, substrate utilization and product formation; Sterilization of air and media; Batch, fed-batch and continuous processes; Various types of microbial and enzyme reactors; Instrumentation control and optimization; Unit operations in solid-liquid separation and liquid-liquid extraction; Process scale-up, economics and feasibility analysis

Engineering principle of bioprocessing- Upstream production and downstream; Bio process design and development from lab to industrial scale; Microbial, animal and plant cell culture platforms; Production of biomass and primary / secondary metabolites; Biofuels, Bioplastics, industrial enzymes, antibiotics; Large scale production and purification of recombinant proteins; Industrial application of chromatographic and membrane based bioseparation methods; Immobilization of biocatalysts ( enzymes and cells ) for bioconversion processes; Bioremediation Aerobic and anaerobic processes for stabilization of solid / liquid wastes

**4 ) Mechanical Engineering Industrial and Prodcution Engineering / Thermal Engineering Applied Mechanics and Design**

**Engineering Mechanics : **Free body diagrams and equilibrium; trusses and frames; virtual work; kinematics and dynamics of particles and of rigid bodies in plane motion, including impulse and momentum ( linear and angular ) and energy formulations; impact, collisions.

**Mechanics of Materials :** Stress and strain, elastic constants, Poisson’s ratio; Mohr’s circle for plane stress and plane strain; thin cylinders; shear force and bending moment diagrams; bending and shear stresses; deflection of beams; torsion of circular shafts; Euler’s theory of columns; energy methods; thermal stresses; strain gauges and rosettes; testing of materials with universal testing machine; testing of hardness and impact strength.

**Theory of Machines : **Displacement, velocity and acceleration analysis of plane mechanisms; dynamic analysis of linkages; cams; gears and gear trains; flywheels and governors; balancing of reciprocating and rotating masses; gyroscope.

**Vibrations : **Free and forced vibration of single degree of freedom systems; effect of damping; vibration isolation; resonance, critical speeds of shafts.

**Design : **Design for static and dynamic loading; failure theories; fatigue strength and the S – N diagram; principles of the design of machine elements such as bolted, riveted and welded joints, shafts, spur gears, rolling and sliding contact bearings, brakes and clutches, springs.

**Fluid Mechanics and Thermal Sciences **

**Fluid Mechanics : **Fluid properties; fluid statics, manometry, buoyancy; control – volume analysis of mass, momentum and energy; fluid acceleration; differential equations of continuity and momentum; Bernoulli’s equation; viscous flow of incompressible fluids; boundary layer; elementary turbulent flow; flow through pipes, head losses in pipes, bends and fittings.

**Heat – Transfer : **Modes of heat transfer; one dimensional heat conduction, resistance concept, electrical analogy, unsteady heat conduction, fins; dimensionless parameters in free and forced convective heat transfer, various correlations for heat transfer in flow over flat plates and through pipes; thermal boundary layer; effect of turbulence; radiative heat transfer, black and grey surfaces, shape factors, network analysis; heat exchanger performance, LMTD and NTU methods; radiative heat transfer, Stefan Boltzmann law, Wien’s displacement law, black and grey surfaces, view factors, radiation network analysis.

**Thermodynamics : **Thermodynamic systems and processes; properties of pure substances, behavior of ideal and real gases; zeroth and first laws of thermodynamics, calculation of work and heat in various processes; second law of thermodynamics; thermodynamic property charts and tables, availability and irreversibility; thermodynamic relations.

**Applications : **Power Engineering: Air and gas compressors; vapour and gas power cycles,

concepts of regeneration and reheat.

**I.C. Engines :** Air-standard Otto, Diesel and dual cycles.

**Refrigeration and air-conditioning :** Vapour and gas refrigeration and heat pump cycles; properties of moist air, psychrometric chart, basic psychrometric processes.

**Turbomachinery :** Impulse and reaction principles, velocity diagrams, Pelton-wheel, Francis and Kaplan turbines

**Materials, Manufacturing and Industrial Engineering**

**Engineering Materials : **Structure and properties of engineering materials, heat treatment, stress – strain diagrams for engineering materials

**Casting, Forming and Joining Processes :** Different types of castings, design of patterns, moulds and cores; solidification and cooling; riser and gating design. Plastic deformation and yield criteria; fundamentals of hot and cold working processes; load estimation for bulk ( forging, rolling, extrusion, drawing ) and sheet ( shearing, deep drawing, bending ) metal forming processes; principles of powder metallurgy. Principles of welding, brazing, soldering and adhesive bonding.

**Machining and Machine Tool Operations : **Mechanics of machining, single and multi – point cutting tools, tool geometry and materials, tool life and wear; economics of machining; principles of non – traditional machining processes; principles of work holding, principles of design of jigs and fixtures

**Metrology and Inspection : **Limits, fits and tolerances; linear and angular measurements; comparators; gauge design; interferometry; form and finish measurement; alignment and testing methods; tolerance analysis in manufacturing and assembly.

**Computer Integrated Manufacturing :** Basic concepts of CAD / CAM and their integration tools

**Production Planning and Control : **Forecasting models, aggregate production planning, scheduling, materials requirement planning.

**Inventory Control : **Deterministic and probabilistic models; safety stock inventory control systems.

**Operations Research : **Linear programming, simplex and duplex method, transportation, assignment, network flow models, simple queuing models, PERT and CPM.

**5 ) Materials Science and Technology **

**Structure : **Atomic structure and bonding in materials. Crystal structure of materials, crystal systems, unit cells and space lattices, determination of structures of simple crystals by x – ray diffraction, miller indices of planes and directions, packing geometry in metallic, ionic and covalent solids. Concept of amorphous, single and polycrystalline structures and their effect on properties of materials. Crystal growth techniques. Imperfections in crystalline solids and their role in influencing various properties

**Diffusion : **Fick’s laws and application of diffusion in sintering, doping of semiconductors and surface hardening of metals.

**Metals and Alloys :** Solid solutions, solubility limit, phase rule, binary phase diagrams, intermediate phases, intermetallic compounds, iron-iron carbide phase diagram, heat treatment of steels, cold, hot working of metals, recovery, recrystallization and grain growth. Microstrcture, properties and applications of ferrous and non-ferrous alloys.

**Ceramics :** Structure, properties, processing and applications of traditional and advanced ceramics.

**Polymers : **Classification, polymerization, structure and properties, additives for polymer products, processing and applications.

**Composites :** Properties and applications of various composites.

**Mechanical Properties :** stress-strain diagrams of metallic, ceramic and polymeric materials, modulus of elasticity, yield strength, tensile strength, toughness, elongation, plastic deformation, viscoelasticity, hardness, impact strength, creep, fatigue, ductile and brittle fracture.

**Thermal Properties : **Heat capacity, thermal conductivity, thermal expansion of materials.

**Electronic Properties :** Concept of energy band diagram for materials – conductors, semiconductors and insulators, electrical conductivity effect of temperature on conductivity, intrinsic and extrinsic semiconductors, dielectric properties.

**Optical Properties : **Reflection, refraction, absorption and transmission of electromagnetic radiation in solids

**Magnetic Properties : **paramagnetism, diamagnetism, antiferro magnetism, ferromagnetism, ferrimagnetism, magnetic hysteresis.

Environmental Degradation: Corrosion and oxidation of materials, prevention

**6 ) Electrical Engineering**

**Electric Circuits and Fields : **Network graph, KCL, KVL, Node and Mesh analysis, Transient response of dc and ac networks, Sinusoidal steady‐state analysis, Resonance, Passive filters, Ideal current and voltage sources, Thevenin’s theorem, Norton’s theorem, Superposition theorem, Maximum power transfer theorem, Two‐port networks, Three phase circuits, Power and power factor in ac circuits.

** Electromagnetic Fields : **Coulomb’s Law, Electric Field Intensity, Electric Flux Density, Gauss’s Law, Divergence, Electric field and potential due to point, line, plane and spherical charge distributions, Effect of dielectric medium, Capacitance of simple configurations, Biot‐Savart’s law, Ampere’s law, Curl, Faraday’s law, Lorentz force, Inductance, Magnetomotive force, Reluctance, Magnetic circuits,Self and Mutual inductance of simple configurations.

**Signals and Systems : **Representation of continuous and discrete – time signals; shifting and scaling operations; linear, timeinvariant and causal systems; Fourier series representation of continuous periodic signals; sampling theorem; Fourier, Laplace and Z transforms.

**Electrical Machines : **Single phase transformer: equivalent circuit, phasor diagram, open circuit and short circuit tests, regulation and efficiency; Three phase transformers: connections, parallel operation; Auto‐transformer, Electromechanical energy conversion principles, DC machines: separately excited, series and shunt, motoring and generating mode of operation and their characteristics, starting and speed control of dc motors; Three phase induction motors: principle of operation, types, performance, torque-speed characteristics, no-load and blocked rotor tests, equivalent circuit, starting and speed control; Operating principle of single phase induction motors; Synchronous machines: cylindrical and salient pole machines, performance, regulation and parallel operation of generators, starting of synchronous motor, characteristics; Types of losses and efficiency calculations of electric machines.

**Power Systems : **Power generation concepts, ac and dc transmission concepts, Models and performance of

transmission lines and cables, Series and shunt compensation, Electric field distribution and insulators, Distribution systems, Per‐unit quantities, Bus admittance matrix, Gauss-Seidel and Newton-Raphson load flow methods, Voltage and Frequency control, Power factor correction, Symmetrical components, Symmetrical and unsymmetrical fault analysis, Principles of over‐current, differential and distance protection; Circuit breakers, System stability concepts, Equal area criterion.

**Control Systems : **Mathematical modeling and representation of systems, Feedback principle, transfer function, Block diagrams and Signal flow graphs, Transient and Steady‐state analysis of linear time invariant systems, Routh-Hurwitz and Nyquist criteria, Bode plots, Root loci, Stability analysis, Lag, Lead and Lead‐Lag compensators; P, PI and PID controllers; State space model, State transition matrix.

**Electrical and Electronic Measurements : **Bridges and potentiometers; PMMC, moving iron, dynamometer and induction type instruments; measurement of voltage, current, power, energy and power factor; instrument transformers; digital voltmeters and multimeters; phase, time and frequency measurement; Q – meters; oscilloscopes; potentiometric recorders; error analysis.

**Analog and Digital Electronics : **Characteristics of diodes, BJT, FET; amplifiers – biasing, equivalent circuit and frequency response; oscillators and feedback amplifiers; operational amplifiers – characteristics and applications; simple active filters; VCOs and timers; combinational and sequential logic circuits; multiplexer; Schmitt trigger; multivibrators; sample and hold circuits; A / D and D / A converters; 8 – bit microprocessor basics, architecture, programming and interfacing.

**Power Electronics : **Characteristics of semiconductor power devices: Diode, Thyristor, Triac, GTO, MOSFET, IGBT; DC to DC conversion: Buck, Boost and Buck-Boost converters; Single and three phase configuration of uncontrolled rectifiers, Line commutated thyristor based converters, Bidirectional ac to dc voltage source converters, Issues of line current harmonics, Power factor, Distortion factor of ac to dc converters, Single phase and three phase inverters, Sinusoidal pulse width modulation.

#### NIFT Admissions

Online Application 14 December 2020 to 21 January 2021.

#### JEE Main

Application Form Submission 16 Dec 2020 to 16 Jan 2021.